Anzeige
Mehr »
Login
Donnerstag, 17.04.2025 Börsentäglich über 12.000 News von 690 internationalen Medien
Antimon bei 59.000 USD/ t - Global Tactical's Antimonminen in den USA mit 32,95 % Gehalt!
Anzeige

Indizes

Kurs

%
News
24 h / 7 T
Aufrufe
7 Tage

Aktien

Kurs

%
News
24 h / 7 T
Aufrufe
7 Tage

Xetra-Orderbuch

Fonds

Kurs

%

Devisen

Kurs

%

Rohstoffe

Kurs

%

Themen

Kurs

%

Erweiterte Suche
Business Wire
57 Leser
Artikel bewerten:
(0)

The Ethernet Alliance(R) Demonstrates Backplane Ethernet at DesignCon 2008

Finanznachrichten News

The Ethernet Alliance today announced its participation and associate sponsorship at DesignCon 2008, where member companies will demonstrate Backplane Ethernet in booth #961, February 5-6 at the Santa Clara Convention Center in Santa Clara, California. Additionally, Ethernet Alliance members and executives will participate in panel sessions on 100GbE, 10+Gb signaling and next-generation electrical signaling.

Ethernet Alliance member companies AMCC, Molex, Tyco Electronics and Vitesse will demonstrate 10GbE Backplane Ethernet featuring state-of-the-art Reference Backplanes, and error-free 10 Gbps data traffic driven by 10GBASE-KR PHY devices. The demonstrations will showcase live traffic using streaming video and signal quality shown through a bit error rate.

"The Ethernet Alliance is proud to bring this demonstration to DesignCon 2008, where we will showcase the capabilities and benefits of 10GbE Backplane Ethernet, said Brad Booth, president, Ethernet Alliance. "We look forward to continuing to promote Ethernet education at DesignCon 2008 and informing potential new members of the benefits and opportunities available to them as Ethernet Alliance members.

The schedules for the technical sessions and panels are as follows:

--Monday, February 4 - Chip, PCB, and Connector Technologies for
    Meeting Today's and Tomorrow's 10+Gb Signaling Requirements: A
    Report on Current Trends and Future Road Maps
    9:00 a.m. - 12:00 p.m.
    Panelists: Brad Booth, AMCC; Dana Bergey and Stefaan Sercu, FCI
    Electronics; Franz Gisin, Sanmina-SCI

--Monday, February 4 - Understanding the Impact of 100G Ethernet
    (Sponsored by The Ethernet Alliance)
    4:45 p.m. - 6:00 p.m.
    Moderator: Loring Wirbel, EE Times
    Panelists: Jason Weil, Cox Communications; Seamus Crehan, Dell'Oro
    Group; Donn Lee, Facebook; Mike Bennett, Lawrence Berkeley
    National Lab; Peter Harrison, Netflix; Ted Seely, Sprint

--Tuesday, February 5 - The Call for Industry Research on
    Next-Generation Electrical Signaling
    3:45 p.m. - 5:00 p.m.
    Moderator: Lee Goldberg, EN-Genius
    Panelists: Mike Resso, Agilent Technologies; Brad Booth, AMCC;
    Joel Goergen, Force10 Networks; David Stauffer, IBM, ASIC Design
    Center; Adam Healey, LSI Corporation; David Brunker, Molex;
    Michael Fogg, Tyco Electronics

About Ethernet Alliance

The Ethernet Alliance is dedicated to promoting industry awareness, acceptance, and advancement of technology and products based on existing and emerging IEEE 802® Ethernet standards. The organization's mission is to accelerate industry adoption and remove barriers to market entry by providing a cohesive, market-responsive industry voice on IEEE 802 Ethernet projects. For more information about the Ethernet Alliance, visit www.ethernetalliance.org.

The Ethernet Alliance and its logo are registered trademarks of the Ethernet Alliance. All other companies and product names may be trademarks of their respective companies.

© 2008 Business Wire
Werbehinweise: Die Billigung des Basisprospekts durch die BaFin ist nicht als ihre Befürwortung der angebotenen Wertpapiere zu verstehen. Wir empfehlen Interessenten und potenziellen Anlegern den Basisprospekt und die Endgültigen Bedingungen zu lesen, bevor sie eine Anlageentscheidung treffen, um sich möglichst umfassend zu informieren, insbesondere über die potenziellen Risiken und Chancen des Wertpapiers. Sie sind im Begriff, ein Produkt zu erwerben, das nicht einfach ist und schwer zu verstehen sein kann.