Tessera Technologies, Inc. (Nasdaq:TSRA) announced that its semiconductor packaging subsidiary, Tessera, Inc., has signed a technology licensing agreement with Nanium, S.A. Nanium, formerly known as Qimonda Portugal, previously was the largest semiconductor packaging assembly and test operation within Qimonda. Nanium has now reorganized as an independent company and will focus on providing assembly and test services for the DRAM memory market and other semiconductor products. Products manufactured by Nanium will be incorporated into computers, servers and various electronic devices such as MP3 players, mobile phones, photographic cameras and game consoles. The initial term of the license agreement runs through the end of 2017.
"Our packaging technologies are foundational elements for the DRAM industry, and will be for many years," said Henry R. Nothhaft, chairman and chief executive officer, Tessera. "In addition to licensing Tessera's innovative chip scale packaging technologies, Nanium has licensed a broad range of Tessera's packaging portfolio. As a result, it will be able to offer its customers an extensive variety of Tessera-enabled packages and technologies to fit their needs, including flip chip, stacked-die, and stacked package configurations."
"Having access to Tessera's packaging technologies will allow us to grow and serve customers in the DRAM market and throughout the semiconductor industry," said Armando Tavares, Nanium's president of the Executive Board. "We can now offer our customers leading edge, licensed technologies to enable their products and businesses."
Under the agreement, Nanium has licensed Tessera's semiconductor packaging technology covering a broad range of chip scale, multi chip and flip chip package types. These technologies include integrated circuit devices packaged in "face-down," "face-up," "stacked-die," "package on package," "system-in-package," and "flip chip" formats, utilizing many different types of materials, including packages using either tape- or laminate-based package substrates.
Safe Harbor Statement
This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to Nanium's use of Tessera's technology, the extent and duration of enablement by Tessera's technology, and industry and technology trends. Material factors that may cause results to differ from the statements made include delays, setbacks or losses relating to our intellectual property or intellectual property litigations, or any invalidation or limitation of our key patents; fluctuations in our operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect our ability to protect our intellectual property; the risk of a decline in demand for semiconductor products; failure by the industry to adopt our technologies; competing technologies; the future expiration of our patents; the future expiration of our license agreements and the cessation of related royalty income; the failure or refusal of licensees to pay royalties; failure to achieve the growth prospects and synergies expected from acquisition transactions; and delays and challenges associated with integrating acquired companies with our existing businesses. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. Tessera's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2008 and its Quarterly Report on Form 10-Q for the quarter ended Sept. 30, 2009, include more information about factors that could affect the company's financial results. Tessera assumes no obligation to update information contained in this press release. Although this release may remain available on Tessera's website or elsewhere, its continued availability does not indicate that Tessera is reaffirming or confirming any of the information contained herein.
About Tessera
Tessera Technologies, Inc. invests in, licenses and delivers innovative miniaturization technologies for next-generation electronic devices. The company's micro-electronics solutions enable smaller, higher-functionality devices through chip-scale, 3D and wafer-level packaging technology, as well as high-density substrate and silent air cooling technology. Tessera's imaging and optics solutions provide low-cost, high-quality camera functionality in electronic products and include image sensor packaging, wafer-level optics and image enhancement intellectual property. The company also offers customized micro-optic lenses, from diffractive and refractive optical elements to integrated micro-optical subassemblies. Tessera licenses its technologies, as well as delivers products based on these technologies, to promote the development of the supply chain infrastructure. The company is headquartered in San Jose, California. For information call 1.408.321.6000 or go to www.tessera.com.
Tessera and the Tessera logo are trademarks or registered trademarks of Tessera, Inc. or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.
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