SINGAPORE -- 22 SEPTEMBER 2014, UNITED STATES -- (Marketwired) -- 09/21/14 -- STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that Mr. Wan Choong Hoe has resigned from his position as Executive Vice President and Chief Operating Officer effective 30 September 2014 to pursue personal interests.
"We thank Choong Hoe for his invaluable contributions and wish him success in his future endeavours," said Mr. Tan Lay Koon, President and Chief Executive Officer, STATS ChipPAC.
Mr. Tan Lay Koon will serve as acting Chief Operating Officer until the Company identifies a suitable candidate.
About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. (SGX-ST Code: S24) is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices throughout Asia, the United States and Europe. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.
Investor Relations Contact:
Tham Kah Locke
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email: Email Contact
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