Research and Markets (http://www.researchandmarkets.com/research/c6m9jj/highdensity) has announced the addition of the "High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends" report to their offering.
High-density packaging offer a host of benefits including performance improvements such as shorter interconnect lengths between die, resulting in reduced time of flight, lower power supply inductance, lower capacitance loading, less cross talk and lower off-chip driver power.
This report examines and projects the technologies involved, their likely developments, what problems and choices are facing users, and where the opportunities and pitfalls are.
Key Topics Covered:
Chapter 1 Introduction
Chapter 2 Executive Summary
2.1 Summary of Technology Issues
2.2 Summary of Market Forecasts
Chapter 3 Technology Issues and Trends
3.1 Overview of HDP Technology
3.2 Technical Constraints of Integration
3.3 Economic Benefits of HDP
3.4 Technology Issues
3.5 3-D Modules
3.6 Superconducting Interconnects
3.7 Known Good Die
3.8 System In Package (SIP)
3.9 Multichip Package
3.10 Package-On-Package (PoP)
Chapter 4 Applications
4.1 Overview of HDP Applications
4.2 Military and Aerospace
4.3 Computer and Peripheral Equipment
4.4 Communications
4.5 Consumer
4.6 Industrial
Chapter 5 Competitive Environment
5.1 Overview of the HDP Competitive Environment
5.2 Joint Ventures and Cooperative Agreements
5.3 HDP Manufacturers
Chapter 6 3-D-TSV Technology
6.1 Driving Forces In 3D-TSV
6.2 3-D Package Varieties
6.3 TSV Processes
6.4 Critical Processing Technologies
6.5 Applications
6.6 Limitations Of 3-D Packaging Technology
6.7 Company Profiles
Chapter 7 Market Forecast
7.1 Overview of Multichip Modules
7.2 Driving Forces
7.3 Alternative Packaging Technologies
7.4 Worldwide IC Market Forecast
7.5 Worldwide Packaging Market Forecast
7.6 Worldwide MCM Market Forecast
7.7 Wafer Level Packaging
Companies Mentioned Partial List
ALLVIA
AMD
AMITEC
AT&T
Advanced Packaging Systems
Aeroflex Laboratories
Amkor
Amkor Electronics
Analog Devices
Conexant
Control Data
Cubic Wafer
David Sarnoff Research Center
Delco Electronics
Digital Equipment
ERIM
Elpaq
Elpida NXP
STATS ChipPAC
STMicroelectronics
Samsung
Samsung Electronics
Sensonix
Sharp
Sharp
Sheldahl
Shinko
Silex Microsystems
Skyworks Solutions
Spansion
Spectra
Thomson Consumer Electronics
Toshiba
For more information visit http://www.researchandmarkets.com/research/c6m9jj/highdensity.
Contacts:
Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
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