BANGALORE, India, Jan. 8, 2024 /PRNewswire/ -- ABF Market is Segmented by Type (Df :Above 0.01, Df :Below 0.01), by Application (Servers & Data Center, PC, Communication Base Station, HPC/AI Chips).
The global ABF (Ajinomoto Build-up Film) Market was valued at USD 482.5 Million in 2023 and is anticipated to reach USD 845.4 Million by 2030, witnessing a CAGR of 7.8% during the forecast period 2024-2030.
Claim Your Free Sample Now: https://reports.valuates.com/request/sample/QYRE-Auto-19L13094/Global_ABF_Ajinomoto_Build_up_Film_Market_Research_Report_2023
Major Factors Driving the Growth of the ABF (Ajinomoto Build-up Film) Market
The persistent advancement of semiconductor technologies, in particular, the need for sophisticated packaging solutions in response to downsizing trends and the growing complexity of electronic devices, is driving the growth of the Ajinomoto Build-up Film (ABF) market. Because of its remarkable dielectric qualities, thermal stability, and adaptability, ABF is a crucial part of semiconductor packaging and can withstand the demanding needs of a wide range of sectors, including consumer electronics, automobiles, 5G infrastructure, and Internet of Things devices.
Unlock Insights: View Full Report Now! https://reports.valuates.com/market-reports/QYRE-Auto-19L13094/global-abf-ajinomoto-build-up-film/
TRENDS INFLUENCING THE GROWTH OF THE ABF (AJINOMOTO BUILD-UP FILM) MARKET
The market for Ajinomoto Build-up Film (ABF) is closely related to the ongoing developments in semiconductor packaging technology. Packaging solutions that enable improved performance and compactness are in greater demand as electronic devices get lighter, smaller, and more complicated. Due to its remarkable dielectric and insulating qualities, ABF has become an essential part of modern semiconductor packaging, which propels the market's growth. One major factor driving the ABF market is the continuous trend of electronic device downsizing. Manufacturers are forced to implement packaging solutions that can support the diminishing size of electronic components because customers are demanding smaller and more efficient devices. Because of its thin and light characteristics, ABF fits in well with these miniaturisation tendencies, which encourages its broad use in a variety of electronic applications.
The growing demand for wearables, tablets, and smartphones among other consumer electronics is one of the main drivers of the ABF industry. The need for sophisticated packaging materials like ABF, which allows small and high-performance gadgets, is growing as the consumer electronics sector continues to thrive. ABF's adaptability in meeting the unique needs of consumer electronics greatly propels the market's expansion.
An important driving force behind the ABF industry is the continuous global rollout of 5G infrastructure. 5G technology requires more connection and faster processing rates, which calls for sophisticated semiconductor packaging techniques. With its ability to handle high-frequency applications and provide effective heat dissipation, ABF plays a crucial role in the creation of infrastructure and devices that are ready for 5G.
The automobile sector is experiencing a significant expansion in the integration of electronics due to advancements in electric cars, autonomous driving, and smart networking. ABF is a popular option for semiconductor packaging in the automotive industry, which promotes market growth. This is due to its ability to fulfil the strict criteria of car electronics, such as thermal stability and dependability.
Own It Today - Buy Now! https://reports.valuates.com/api/directpaytoken?rcode=QYRE-Auto-19L13094&lic=single-user
ABF (AJINOMOTO BUILD-UP FILM) MARKET SHARE
With a market share of more than 99 percent, Japan is the biggest producer of ABF (Ajinomoto Build-up Film), followed by Chemical Co., Ltd., WaferChem Technology Corporation, Taiyo Ink, etc.
Purchase Regional Report on United States and Canada: https://reports.valuates.com/market-reports/QYRE-Auto-19L13094/global-abf-ajinomoto-build-up-film/7
Key Companies:
? Ajinomoto Fine-Techno
? WaferChem Technology Corporation
? TAIYO INK
? Elite Material Co. Ltd.
? Wuhan Sanxuan Technology
? Shenzhen EPS Technology
? Sekisui Chemical Co., Ltd.
Purchase Corporate Profiles: https://reports.valuates.com/market-reports/QYRE-Auto-19L13094/global-abf-ajinomoto-build-up-film/12
SUBSCRIPTION
We have introduced a tailor-made subscription for our customers. Please leave a note in the Comment Section to know about our subscription plans.
DISCOVER MORE INSIGHTS: EXPLORE SIMILAR REPORTS!
-ABF (Ajinomoto Build-up Film) Substrate Market revenue was US$ 5888 million in 2022 and is forecast to a readjusted size of US$ 9332.3 million by 2029 with a CAGR of 6.9% during the forecast period (2023-2029).
-Build-up Film Market
-FC BGA market was valued at US$ 4369 million in 2022 and is anticipated to reach US$ 6530.4 million by 2029, witnessing a CAGR of 5.6%.
-Flip Chip Ball Grid Array (FCBGA) market is projected to grow from US$ 4650.4 million in 2023 to US$ 6448.7 million by 2029, at a Compound Annual Growth Rate (CAGR) of 5.6%.
-IC Substrate Resin Market
-Semiconductor OHT (Overhead Hoist Transport) market is expected to reach to US$ 719 million in 2023, with a positive growth of %, compared with US$ 669 million in 2022. Backed with the increasing demand from downstream industries, Semiconductor OHT (Overhead Hoist Transport) industry is evaluated to reach US$ 1246.2 million in 2029. The CAGR will be 9.6% during 2023 to 2029.
-Semiconductor Liquid Filters market size is estimated to be worth USD 444.89 Million in 2022 and is forecast to a readjusted size of USD 876.32 Million by 2029 with a CAGR of 11.8% during the review period.
-AMC Filters for Semiconductor market is projected to reach USD 559.6 million by 2028 from an estimated USD 399.2 million in 2022, at a CAGR of 5.8%.
- The global Power Semiconductor market was valued at US$ 46070 million in 2022 and is anticipated to reach US$ 66420 million by 2029, witnessing a CAGR of 5.3%.
-Wireless System-on-Chip (SoC) for IoT Device Market
-Automotive Semiconductor Market
-Semiconductor Manufacturing Equipment Market
-Semiconductor Materials Market
- The Semiconductor Equipment Spare Parts market is projected to reach US$ 67290 million in 2029 at a CAGR of 5.6%.
-Semiconductor Wafer Transfer Robots market is projected to reach US$ 1868.3 million in 2029 at a CAGR of 4.9%.
-Semiconductor Material Recycle Services Market
-Semiconductor Parts Cleaning and PM Services Market
-BARC and TARC market is projected to grow from US$ 289.8 million in 2023 to US$ 430.5 million by 2029, at a Compound Annual Growth Rate (CAGR) of 6.8%.
-Blocker Plate for Semiconductor Equipment market is projected to reach US$ 31 million in 2029, with a CAGR of 5.0%.
-Signal Processor (ISP) IP market is anticipated to reach US$ 362.4 million by 2029, witnessing a CAGR of 6.5%.
-Wafer Spin Rinse Dryer Systems Market
-Photosensitive Polyimide (PSPI) Market
- The Epoxy Resin Moulding Compound market is projected to reach US$ 2816 million in 2029 with the CAGR of 3.7%.
-HFC-32 Refrigerant market size is expected to reach US$ 1387.5 million by 2029, growing at a CAGR of 3.4% from 2023 to 2029.
-Semiconductor SOD (Spin-On Dielectric) Market
-Optical Critical Dimension (OCD) Measurements Equipment market is anticipated to reach US$ 3170.9 million by 2029, witnessing a CAGR of 16.2% during the forecast period 2023-2029.
-High Resolution Semiconductor ICP-MS System Market
-Semiconductor IP Licensing market is projected to reach US$ 1149.5 million in 2029, increasing from US$ 765 million in 2022, with a CAGR of 6.7%.
-Semiconductor Grade Isopropyl Alcohol Market
-Semiconductor Pellicle market is projected to reach US$ 1998.1 million in 2029, increasing from US$ 1209 million in 2022, with a CAGR of 7.1% during the period of 2023 to 2029.
-High Reliability Semiconductor Devices market is projected to reach US$ 3612.3 million in 2029, increasing from US$ 2550 million in 2022, with a CAGR of 5.0%.
-Semiconductor Vacuum Sensors market is projected to reach US$ 579 million in 2029, with a CAGR of 8.7% during the period of 2023 to 2029.
-Semiconductor Bellows market is projected to reach US$ 114.5 million in 2029, with a CAGR of 4.3%.
-Cable and Cable Assemblies for Semiconductor Equipment market is projected to reach US$ 488.3 million in 2029, with a CAGR of 5.1%.
DISCOVER OUR VISION: VISIT ABOUT US!
Valuates offers in-depth market insights into various industries. Our extensive report repository is constantly updated to meet your changing industry analysis needs.
Our team of market analysts can help you select the best report covering your industry. We understand your niche region-specific requirements and that's why we offer customization of reports. With our customization in place, you can request for any particular information from a report that meets your market analysis needs.
To achieve a consistent view of the market, data is gathered from various primary and secondary sources, at each step, data triangulation methodologies are applied to reduce deviance and find a consistent view of the market. Each sample we share contains a detailed research methodology employed to generate the report. Please also reach our sales team to get the complete list of our data sources.
YOUR FEEDBACK MATTERS: REACH OUT TO US!
Valuates Reports
sales@valuates.com
For U.S. Toll-Free Call 1-(315)-215-3225
WhatsApp: +91-9945648335
Website: https://reports.valuates.com
Blog: https://valuatestrends.blogspot.com/
Pinterest: https://in.pinterest.com/valuatesreports/
Twitter: https://twitter.com/valuatesreports
Facebook: https://www.facebook.com/valuatesreports/
https://www.facebook.com/valuateskorean
https://www.facebook.com/valuatesspanish
https://www.facebook.com/valuatesjapanese
View original content:https://www.prnewswire.co.uk/news-releases/abf-ajinomoto-build-up-film-market-size-was-valued-at-usd-537-5-million-in-2024-and-is-anticipated-to-grow-usd-845-4-million-by-2030-at-a-cagr-of-7-8--valuates-reports-302028431.html
