Toppan Photomask Signs Deal With IBM For Joint R&D On Semiconductor EUV Photomasks

Realtime	Geld	Brief	Zeit
	62,86	63,12	21.12.
	62,56	63,07	20.12.

Realtime

Geld

Brief

Zeit

62,86

63,12

21.12.

62,56

63,07

20.12.

Toppan Photomask Signs Deal With IBM For Joint R&D On Semiconductor EUV Photomasks

ARMONK (dpa-AFX) - Toppan Photomask said that it has reached a joint research and development agreement with IBM related to the 2 nanometer or nm logic semiconductor node, using extreme ultraviolet (EUV) lithography. The agreement also includes High-NA EUV photomask development capability on next-generation semiconductors.

Under the agreement, IBM and Toppan Photomask intend to collaborate over a five-year period, commencing in the first quarter 2024, to enhance photomask capability at the Albany NanoTech Complex in Albany, NY, USA, and Toppan Photomask's Asaka Plant in Niiza, Japan.

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INTERNATIONAL BUSINESS MACHINES CORPORATION	214,15	-0,05 %
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TOPPAN HOLDINGS INC	23,600	-7,09 %

Unternehmen / Aktien

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INTERNATIONAL BUSINESS MACHINES CORPORATION

214,15

-0,05 %

ON SEMICONDUCTOR CORPORATION

62,90

+0,16 %

TOPPAN HOLDINGS INC

23,600

-7,09 %

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