In the news release, NewPhotonics Introduces NPG102 Transmitter-on-Chip for DSP-based Optical Modules Serving 1.6 Tbps AI-era Data Center Interconnect, issued Sept. 19, 2024 by NewPhotonics Ltd over PR Newswire, we are advised by the company that there are edits to the release. The complete, corrected release follows:
NewPhotonics Introduces NPG102 Transmitter-on-Chip for DSP-based Optical Modules Serving 1.6 Tbps AI-era Data Center Interconnect
Optical head transmitter with integrated lasers enables all-optics transceiver innovation in network and compute infrastructure
TEL AVIV, Israel, Sept. 19, 2024 /PRNewswire/ -- NewPhotonics Ltd., a leader in advanced integrated photonics technologies, today introduced its NPG102 PIC transmitter on chip (TOC) at 1.6Tbps for DSP-based optical transceiver modules to join the NPG102 TOC for LPO-based modules announced in March supporting the LPO and LRO optical transceiver market where no DSP is required.
The addition of the NPG102 TOC for DSP-based modules to our suite of PIC solutions delivers the low latency data communications at low power consumption and reduced channel loss core to the NPG102 chip technology designed to meet the increasing AI-cluster processing demands on data center infrastructure.
The optimized flip-chip integrates octal channel, auto-tunable lasers and 224Gbps PAM4 modulation featuring aggregated bandwidth at 1.6Tbps with electrical to optical transmission. Internal ADC/DAC supports channel control and monitoring in a package with on-chip temperature monitoring at low 2.9W power consumption.
Integrated Lasers Improve Module Time to Market
Designed for pluggable OSFP modules, the monolithically integrated lasers and modulators improve system integration with wafer-level laser alignment and integrated direct modulation. This additional advantage of all-optics innovation in the transceiver chip design results in accelerated OEM manufacturing yield maturity and time to market for transceiver module delivery.
"As data centers worldwide strive to accelerate infrastructure improvements that enhance AI workload performance, the entire value chain is seeking progressive solutions that deliver faster and more energy efficient data processing." said Doron Tal, senior vice president and general manager of Optical Connectivity. "The NPG102 TOC for 1.6Tbps DSP-based modules joins our NPG102 chip for LPO on our all-optics innovation roadmap of generational of solutions allowing us to serve the needs of both DSP-based pluggable and LPO-based pluggable optics segments and put data centers on a path in this decade to deliver higher capacity, low power optical connectivity."
The NewPhotonics NPG102 PIC transmitter-on-chip for DSP-based transceiver modules is available in our Easly Access Program with market availability expected in the second quarter of 2025.
About NewPhotonics
NewPhotonics is a fabless semiconductor designs, develops and manufactures photonic integrated circuit (PIC) solutions for AI-era data center optical communications. Our integrated NPG102 PIC transmitter on chip family delivers low latency, reduced power in optical transceiver modules for all-optics connectivity. The company's silicon photonics innovations breakthrough speed, energy and distance barriers in optical I/O in a new all-optics paradigm. NewPhotonics, based in Tel Aviv, Israel, is privately held and funded. For more information visit www.newphotonics.com
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