Zeit | Aktuelle Nachrichten | ||
---|---|---|---|
Do | Echion ramps niobium battery material rollout with another £10m | ||
Do | Folded lens, a next-generation nano-optical device | ||
Do | French photonics firm taps Qualcomm for new CEO | ||
Do | Eliyan ports chiplet interconnect to Samsung 4nm process | ||
Do | 5D imaging radar for L3+ systems | ||
Mi | BYD Semiconductor shows automotive controller chips | ||
Mi | CEO interview: Eyal Peso, Gauzy | ||
Mi | TSMC drives A16, 3D process technology | ||
Mi | Sony sensor quadruples performance for industrial imaging | ||
Mi | Compact 3D low-power ToF sensor delivers high performance | ||
Mi | First complete memory interface for next generation DDR5 server MRDIMMs | ||
Mi | Report: Robotics advances to drive human-machine collaboration | ||
Mi | New on-chip device uses exotic light to detect molecules | ||
Mi | First room temperature quantum computer in Europe | ||
Mi | $1bn US semiconductor digital twin centre approved | ||
Di | First DDS provider to meet all major automotive software standards | ||
Di | SuperNIC startup Enfabrica raises US$115 million in Series C | ||
Di | d-Matrix launches Corsair for AI inference without GPUs, HBM | ||
Di | AI inferencing at 100 times lower MAC power and 20 fold lower cost | ||
Di | Next-gen 3D printing to harness fusion energy | ||
Di | High-voltage capacitors deliver low ESR in industrial applications | ||
Di | Another 500 jobs at AMS-Osram hit by uncertain outlook | ||
Di | Gate driver ICs target consumer/industrial three-phase BLDC motors | ||
Di | LTE Cat 1bis module with embedded eSIM for flexible switching | ||
Di | Quantinuum to use Infineon ion traps for fault tolerant quantum computer |