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- letzte 200 News
| Zeit | Aktuelle Nachrichten | ||
|---|---|---|---|
| 19.11. | Scintil appoints Matt Crowley as CEO and establishes US subsidiary | ||
| 19.11. | IQE's flat revenue forecast for 2024 prompts strategic review | ||
| 19.11. | Gregg Lowe departs Wolfspeed as president & CEO | ||
| 18.11. | Aixtron's revenue rebounds in Q3 as red LED resurgence compensates for SiC market dip | ||
| 18.11. | CVD Equipment's Q3 revenue grows 31% year-on-year | ||
| 18.11. | Microelectronics Commons Hubs gain extra $160m in US CHIPS Act funding | ||
| 15.11. | Ayar Labs showcasing future of AI infrastructure with Fujitsu, Intel Foundry, Corning and Altera | ||
| 15.11. | IntelliEPI awarded Texas Semiconductor Innovation Fund's first grant | ||
| 15.11. | Wise-integration expands in North America with Ottawa Design Center | ||
| 15.11. | SMART Photonics and X-FAB collaborate on multi-Terabit transceivers | ||
| 14.11. | Toshiba ships early test samples of bare die 1200V SiC MOSFET | ||
| 14.11. | Boron enables AlN on silicon growth without cracks | ||
| 14.11. | Akash allocated US CHIPS Act funding for diamond cooling technology | ||
| 14.11. | CGD and IFPEN demo GaN-based 800VDC inverter that outperforms SiC | ||
| 14.11. | BluGlass enters into contract with NCSU for visible laser development as part of CLAWS Hub | ||
| 14.11. | Richardson expands Navitas silicon carbide power device distribution | ||
| 13.11. | SK Siltron CCS gets $481.5m US DOE loan to expand silicon carbide wafer manufacturing | ||
| 13.11. | NexGen Wafer Systems launches SERENO wet etch and clean multi-chamber platform | ||
| 13.11. | India's Solid State Physics Lab develops SiC wafers and GaN HEMTs for up to X-band | ||
| 13.11. | Sivers pauses discussions on spinning off Photonics subsidiary | ||
| 13.11. | NS Nanotech appoints John Bayne to board | ||
| 12.11. | Cree LED launches CV28D LEDs with FusionBeam Technology for LED signs and displays | ||
| 12.11. | Mitsubishi Electric to ship samples of SiC MOSFET bare die for xEVs | ||
| 12.11. | ROHM launches surface-mount SiC Schottky barrier diodes with 1.3x greater creepage distance for improved insulation resistance | ||
| 11.11. | Linköping-based TekSiC appoints Joachim Tollstoy as CEO |
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