Zeit | Aktuelle Nachrichten | ||
---|---|---|---|
15.10. | Infineon launches HybridPACK Drive G2 Fusion power module | ||
14.10. | Navitas launches GaNSlim power ICs for ease-of-use, system cost and energy savings in mobile, consumer and home appliances | ||
14.10. | Planned 8-inch silicon carbide wafer fabs worldwide reach 14 | ||
14.10. | Seoul Semi wins Unified Patent Court case against Expert e-Commerce | ||
14.10. | Micro-LEDs maintain momentum despite Apple's withdrawal | ||
11.10. | PhotonVentures Fund I receives €5m investment from Invest-NL | ||
11.10. | TriEye and HLJ unveil joint SWIR sensing and imaging solution | ||
11.10. | Ohio State selects Taiyo Nippon Sanso MOCVD and HVPE platforms for R&D of nitride and oxide materials and devices | ||
11.10. | Double V-pits enhance red InGaN LED internal quantum efficiency | ||
11.10. | Infineon and AWL-Electricity partner to improve wireless power | ||
10.10. | UKRI grants £5.5m for new Responsible Electronics and Circular Technologies Centre | ||
09.10. | Navitas adds TOLT package to GaNSafe family | ||
09.10. | PhotonDelta launches engineering contest to drive photonic chip applications | ||
09.10. | Latest issue of Semiconductor Today now available | ||
08.10. | QPT wins APC project grant to develop high-frequency GaN inverter demonstrator for automotive | ||
08.10. | Keysight unveils 3kV high-voltage wafer test system for power semiconductors | ||
08.10. | Lynred acquires SWIR imaging provider New Imaging Technologies | ||
08.10. | NUBURU secures strategic $65m funding program to accelerate commercialization | ||
07.10. | Penn State and UCSB team gain three-year, $2m NSF Future of Semiconductors grant | ||
04.10. | UK project to facilitate secure quantum key distribution with high-performance OEM receiver modules | ||
03.10. | HyperLight raises $37m in Series B funding round to accelerate product development and meet demand | ||
03.10. | Polar Light partners with Finetech to connect pyramidal GaN micro-LEDs | ||
02.10. | DARPA awards HexaTech AlN substrate development contract | ||
02.10. | Raytheon to develop ultra-wide-bandgap semiconductors for DARPA | ||
02.10. | NREL to design silicon carbide-based power inverters for US ground combat vehicles |