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Aktuelle News von Semiconductor Today

  • 24 h
  • letzte 200 News
ZeitAktuelle Nachrichten
06.12.24Navitas showcasing GaN and SiC technologies at CES 2025
06.12.24VisIC and AVL partner on GaN inverters for EVs
05.12.24Graded barriers bandwidth boost for micro-LEDs on silicon
05.12.24Soitec and GlobalFoundries collaborate on RF-SOI production
05.12.24US DoE awards eight winners for Phase 1 of Silicon Carbide (SiC) Packaging Prize
05.12.24GlobalFoundries' gains $9.5m more in US funding for Vermont 200mm GaN-on-Si chip production
05.12.24ROHM's EcoSiC technology adopted by power supply maker COSEL
04.12.24AKM ships its smallest and thinnest InAs Hall element, with volume shrunk by 85%
04.12.24ST launches 250W MasterGaN reference design, fast-tracking compact, efficient industrial power supplies
04.12.24Navitas appoints GeneSiC founder Ranbir Singh to board
04.12.24Navitas ranked in Deloitte Technology Fast 500 list for third consecutive year
04.12.24Micro-LED chip market to grow from $38.8m in 2024 to $489.5m by 2028
03.12.24ST supplying silicon carbide power modules to Renault for Ampere's EVs
03.12.24Japan investing ¥70.5bn in ¥211.6bn joint DENSO-Fuji Electric plan to boost SiC power semi production
02.12.24QPT files patent for die attach process that boosts waste heat removal by up to 15x
02.12.24SemiLEDs' revenue falls by 13.3% for full fiscal year, but stabilized in Q4
02.12.24Australia's MTM to develop US-based critical materials recovery for Indium Corp
02.12.24Infineon wins German Sustainability Award in category 'Electrical Engineering and Electronics'
29.11.24ams OSRAM and Fraunhofer IZM win Deutscher Zukunftspreis
28.11.24Indium phosphide laser on silicon nitride photonic circuit
28.11.24CSA Catapult outlines steps to create UK semiconductor 'super cluster' and drive long term growth and exports
28.11.24Vishay investing £51m in Newport Wafer Fab
28.11.24US CHIPS Incentives Program awards finalized for BAE Systems and Rocket Lab
27.11.24Aeluma joins Optica as corporate member
27.11.24AlixLabs debuting 300mm APS wafer processing equipment at SEMICON Japan